ImpaQ Ecosystem•Clarivate, Scopus & CORE Data
Clarivate WoS 2024 / 2025 Data
IMPAQ
WoS SCIE Q1Subscription

IEEE Transactions on Advanced Packaging

Acronym:tadvp-ieee
•
Abbreviation (ISO):IEEE TRANS. ADV. PACKAG
•
Identifier (ISSN):1521-3323(Print)
Clarivate JCR Index Advisory: Not Indexed in Latest JCR
Clarivate Impact Factor (IF 2024)
N/A
Journal Impact Factor
IF Trend↓
WoS Quartile
Q1
WoS SCIEJCR Quartile
Clarivate WoS JCR
WoS Categories↓

Impact Factor Trend (2018–2023)

Clarivate IF trend for IEEE Transactions on Advanced Packaging

WoS Q1
0000020180201902023
Annual Impact Factor Metric
Current (2023):0
Scopus SJR & Rank
N/A

SCImago Journal Rank citation prestige weighting

Scopus / Elsevier Data
H-Index (Hirsch Index)
N/A

papers with at least that number of citations each

WoS: SCIE / JCRQ1
Self-Citation RateN/A
Safe Level (< 15%)Warning Level (> 20%)
Self-citation below 15% indicates strong scholarly independence.
Volume & Open AccessSubscription
1articles/year
0% Gold OA•0% Original Research

Aims & Scope

IEEE Transactions on Advanced Packaging (acronym: tadvp-ieee, abbr: IEEE TRANS. ADV. PACKAG, ISSN: 1521-3323) is a peer-reviewed international scholarly journal in the field of Engineering & Technology, in United States. The periodical holds tracked under Web of Science (SCIE) in quartile Q1.

Topics Covered (Recognized by AI)
Engineering91.3%Computer science89.9%Physics86.6%Electrical engineering80.9%Materials science74.4%Electronic engineering71.7%Telecommunications64.7%Quantum mechanics61%Optoelectronics59.4%Composite material54.7%Operating system51.8%Chemistry49.3%Chip35.8%Nanotechnology34.3%Organic chemistry33.7%Optics30.3%Metallurgy29.4%Physical chemistry29.3%Thermodynamics29%Mathematics28.8%Integrated circuit28.6%Mechanical engineering27.6%Computer network27.2%Electronic packaging25.4%Integrated circuit packaging22.2%Layer (electronics)20.7%

WoS Categories & Quartiles

Detailed JCR / JCI category rankings and quartile breakdown from Clarivate

Clarivate JCR

No WoS category details available for this journal.

Annual Historical Statistics & Publications

Track annual publication volume, total citations, and Impact Factor evolution

14 year
2023Latest
IF0
Articles / Year1
Total Citations50
2019
IF0
Articles / Year—
Total Citations—
2018
IF0
Articles / Year—
Total Citations—
2010
IF—
Articles / Year104
Total Citations1,578
2009
IF—
Articles / Year171
Total Citations3,509

SCImago & Scopus Journal Intelligence

Not indexed in SCImago / Scopus database

This journal is currently not indexed in Scopus or is an academic publication indexed exclusively in Web of Science (WoS).

Academic Metric Intelligence

Journal Metrics & Citation Visualizations

Total Cites vs Self-Cites

Evaluation of scholarly independence and citation reach

Total citations steady growth
Self-citation: N/A

Citations per Document

Citation metric windows across 2, 3, and 4 years

Cites / Doc (4 years)Cites / Doc (3 years)Cites / Doc (2 years)

Chinese Academy of Sciences (CAS) Classification

Major / minor zone classification and CAS Early Warning List history

Major Category (Broad Field):
Updating
Minor Category (Specific Field):
Updating
CAS Early Warning List History:
Updated annually: 2020 – 2024
2020
Not warned
2021
Not warned
2022
Not warned
2023
Not warned
2024
Not warned

Academic Intelligence Overview & Context

ImpaQ Analysis

IEEE Transactions on Advanced Packaging (acronym: tadvp-ieee, abbr: IEEE TRANS. ADV. PACKAG, ISSN: 1521-3323) is a peer-reviewed international scholarly journal in the field of Engineering & Technology, in United States. The periodical holds tracked under Web of Science (SCIE) in quartile Q1.

The journal enforces rigorous peer evaluation with a publication frequency of Quarterly, an annual output of approximately 1 scientific articles. In terms of accessibility and author fees, it operates under the Subscription model with APC fees are not specified. It serves as a benchmark publication platform for academics, researchers, and doctoral candidates seeking global research visibility.

Publishing & Editorial Information

Detailed publisher, peer-review turnaround, and publication cycle specifications

Open Access Model
Subscription
Publisher
Updating
Publication Language
English
Frequency
Quarterly
Indexing & Databases
PubMed
Editorial Address
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

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Record UUID: b1f241bf-31af-4d16-894b-45065817f4f6
Database Updated: 2026-09-28