IEEE Transactions on Components Packaging and Manufacturing Technology
Impact Factor Trend (2018–2026)
Clarivate IF trend for IEEE Transactions on Components Packaging and Manufacturing Technology
SCImago Journal Rank citation prestige weighting
122 papers with at least that number of citations each
Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Special Issues
Calls for PapersNo active Calls for Papers found for this journal.
WoS Categories & Quartiles
Detailed JCR / JCI category rankings and quartile breakdown from Clarivate
ENGINEERING, ELECTRICAL & ELECTRONIC
ENGINEERING, MANUFACTURING
MATERIALS SCIENCE, MULTIDISCIPLINARY
ENGINEERING, ELECTRICAL & ELECTRONIC
ENGINEERING, MANUFACTURING
MATERIALS SCIENCE, MULTIDISCIPLINARY
Annual Historical Statistics & Publications
Track annual publication volume, total citations, and Impact Factor evolution
SCImago & Scopus Journal Intelligence
Global SCImago ranking, SJR prestige index, Scopus coverage, and societal policy impact
Weighted prestige citation metric per document indexed in the Scopus database.
Average citations received per document published in the 2-year window.
Estimated Article Processing Charge for Open Access publication.
Scopus 3-Year Publication & Citation Window
Aggregated from Scopus database across the 3-year SJR evaluation window.
Societal Impact & Inclusivity (SCImago)
Citations in government and international policy documents
Percentage of female authors published in the journal
Real-world societal policy reach and author gender diversity tracked by SCImago.
Scopus Subject Categories
Journal Metrics & Citation Visualizations
Total Cites vs Self-Cites
Evaluation of scholarly independence and citation reach
Citations per Document
Citation metric windows across 2, 3, and 4 years
Chinese Academy of Sciences (CAS) Classification
Major / minor zone classification and CAS Early Warning List history
Academic Intelligence Overview & Context
ImpaQ AnalysisIEEE Transactions on Components Packaging and Manufacturing Technology (abbr: IEEE T COMP PACK MAN, ISSN: 2156-3950) is a peer-reviewed international scholarly journal in the field of ENGINEERING, published by Institute of Electrical and Electronics Engineers Inc. in United States since 2011. The periodical holds a Journal Impact Factor (JIF) of 3.30, ranking in quartile Q2 of Web of Science (SCIE), a Scopus SJR indicator of 0.763 (Q1), an H-index of 122.
The journal enforces rigorous peer evaluation with an annual output of approximately 229 scientific articles. In terms of accessibility and author fees, it operates under the Hybrid model with an estimated APC of $3,080 USD. It serves as a benchmark publication platform for academics, researchers, and doctoral candidates seeking global research visibility.
Publishing & Editorial Information
Detailed publisher, peer-review turnaround, and publication cycle specifications
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