ImpaQ Ecosystem•Clarivate, Scopus & CORE Data
Clarivate WoS 2024 / 2025 Data
IMPAQ
WoS SCIE Q3Scopus Q2SCImago #12,987Hybrid

IEEE Transactions on Device and Materials Reliability

Acronym:tdmr
•
Abbreviation (ISO):IEEE TRANS. DEVICE MATER. RELIAB
•
Identifier (ISSN):1530-4388(Print)
•
Publisher:Institute of Electrical and Electronics Engineers Inc.
Clarivate IF (2026)
2.7↑ +0.4
Journal Impact Factor
IF Trend↓
WoS Quartile
Q3
WoS SCIEJCR Quartile
Clarivate WoS JCR
WoS Categories↓
JCR Release Date: 2026-06-17

Impact Factor Trend (2018–2026)

Clarivate IF trend for IEEE Transactions on Device and Materials Reliability

WoS Q3
01341.5120181.5820191.4120201.7620211.892022220232.520242.320252.72026
Annual Impact Factor Metric
Current (2026):2.7
Scopus SJR & RankScopus Q2
0.451
#12,987

SCImago Journal Rank citation prestige weighting

Scopus Year: 2025
H-Index (2025)
85

85 papers with at least that number of citations each

WoS: SCIE / JCRQ3
Self-Citation Rate4%
Safe Level (< 15%)Warning Level (> 20%)
Self-citation below 15% indicates strong scholarly independence.
Volume & Open AccessHybrid
80articles/year
1.55% Gold OA•98.21% Original Research

Aims & Scope

The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.

Topics Covered (Recognized by AI)
Engineering94.6%Physics84.3%Materials science83.5%Electrical engineering77.1%Quantum mechanics75.3%Computer science70.6%Optoelectronics54.7%Thermodynamics48.7%Electronic engineering46.9%Chemistry42.7%Voltage38.5%Composite material37%Organic chemistry34.8%Power (physics)34.6%Nanotechnology28%Reliability (semiconductor)27.8%Telecommunications26%Metallurgy25.8%Transistor25.6%Reliability engineering25.2%Mathematics23.8%Operating system21.9%

WoS Categories & Quartiles

Detailed JCR / JCI category rankings and quartile breakdown from Clarivate

Clarivate JCR & JCI
JCRSCIE2026

ENGINEERING, ELECTRICAL & ELECTRONIC

Q3
Rank186/369
IndexSCIE
JCRSCIE2026

PHYSICS, APPLIED

Q3
Rank107/191
IndexSCIE
JCISCIE2026

ENGINEERING, ELECTRICAL & ELECTRONIC

Q3
Rank193/371
IndexSCIE
JCISCIE2026

PHYSICS, APPLIED

Q2
Rank93/191
IndexSCIE

Annual Historical Statistics & Publications

Track annual publication volume, total citations, and Impact Factor evolution

12 year
2026Latest
IF2.7
Articles / Year112
Total Citations98
2025
IF2.3
Articles / Year151
Total Citations231
2024
IF2.5
Articles / Year109
Total Citations479
2023
IF2
Articles / Year102
Total Citations629
2022
IF1.886
Articles / Year96
Total Citations767

SCImago & Scopus Journal Intelligence

Global SCImago ranking, SJR prestige index, Scopus coverage, and societal policy impact

Rank #12,987Scopus Q2SCImago Profile
Scopus Coverage:2001-2026
Scopus Broad Areas:EngineeringMaterials Science
Scopus Citation Rank (SJR)Q2
0.451

Weighted prestige citation metric per document indexed in the Scopus database.

Quartile: Scopus Q2
Citations / Doc (2 years)
2.80

Average citations received per document published in the 2-year window.

2-Year Citation Window
Estimated Publication Fee (APC)
$2,880 USD

Estimated Article Processing Charge for Open Access publication.

Estimated cost / article

Scopus 3-Year Publication & Citation Window

3-Year Citations625
3-Year Documents210
Citable Documents205

Aggregated from Scopus database across the 3-year SJR evaluation window.

Societal Impact & Inclusivity (SCImago)

Policy Citations (Overton)0

Citations in government and international policy documents

Female Author Rate26.8%

Percentage of female authors published in the journal

Real-world societal policy reach and author gender diversity tracked by SCImago.

Scopus Subject Categories

Electrical and Electronic EngineeringQ2
Safety, Risk, Reliability and QualityQ2
Electronic, Optical and Magnetic MaterialsQ3
Academic Metric Intelligence

Journal Metrics & Citation Visualizations

Total Cites vs Self-Cites

Evaluation of scholarly independence and citation reach

Total citations steady growth
Self-citation: 4%

Citations per Document

Citation metric windows across 2, 3, and 4 years

Cites / Doc (4 years)Cites / Doc (3 years)Cites / Doc (2 years)

Chinese Academy of Sciences (CAS) Classification

Major / minor zone classification and CAS Early Warning List history

Major Category (Broad Field):
3区 (Zone 3)Engineering & Technology
Minor Category (Specific Field):
3区ENGINEERING, ELECTRICAL & ELECTRONIC
CAS Early Warning List History:
Updated annually: 2020 – 2024
2020
Not warned
2021
Not warned
2022
Not warned
2023
Not warned
2024
Not warned

Academic Intelligence Overview & Context

ImpaQ Analysis

IEEE Transactions on Device and Materials Reliability (acronym: tdmr, abbr: IEEE TRANS. DEVICE MATER. RELIAB, ISSN: 1530-4388) is a peer-reviewed international scholarly journal in the field of Engineering & Technology, published by Institute of Electrical and Electronics Engineers Inc. in United States. The periodical holds a Journal Impact Factor (JIF) of 2.70, ranking in quartile Q3 of Web of Science (SCIE), a Scopus SJR indicator of 0.451 (Q2), an H-index of 85.

The journal enforces rigorous peer evaluation with a publication frequency of Quarterly, an annual output of approximately 80 scientific articles. In terms of accessibility and author fees, it operates under the Hybrid model with an estimated APC of $2,880 USD. It serves as a benchmark publication platform for academics, researchers, and doctoral candidates seeking global research visibility.

Publishing & Editorial Information

Detailed publisher, peer-review turnaround, and publication cycle specifications

Open Access Model
Hybrid
Publisher
Institute of Electrical and Electronics Engineers Inc.
Publication Language
English
Frequency
Quarterly
Indexing & Databases
SCIEScopusPubMed
Editorial Address
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

Similar Journals in Discipline

Journals in the same research field with comparable impact metrics

Record UUID: 34c6f5ff-82c3-40ca-926a-a9b48d722c55
Database Updated: 2026-09-28