What is the Impact Factor of IEEE Transactions on Electronics Packaging Manufacturing?

The journal IEEE Transactions on Electronics Packaging Manufacturing is indexed in Web of Science (SCIE, quartile Q1) with official metrics continually updated on ImpaQ.

Is IEEE Transactions on Electronics Packaging Manufacturing indexed in Web of Science or Scopus?

Yes, IEEE Transactions on Electronics Packaging Manufacturing is indexed in Web of Science (SCIE, Q1 quartile). Furthermore, in Scopus (SCImago), it holds an SJR rating of N/A (Q1) and an H-index of N/A.

Who publishes IEEE Transactions on Electronics Packaging Manufacturing and what is the Article Processing Charge (APC)?

IEEE Transactions on Electronics Packaging Manufacturing is published by International Academic Publisher. For exact article processing charges and subscription guidelines, consult the official editorial guidelines.

What is the ISO-4 abbreviation and acronym of IEEE Transactions on Electronics Packaging Manufacturing?

The official ISO-4 abbreviation of IEEE Transactions on Electronics Packaging Manufacturing is "IEEE TRANS. ELECTRON. PACKAG. MANUF" with common acronym "tepm-ieee". This standardized title abbreviation is used in citation lists conforming to IEEE, APA, Harvard, or Vancouver styles.

WoS SCIE Q1Subscription

IEEE Transactions on Electronics Packaging Manufacturing

Acronym:tepm-ieee

•

Abbreviation (ISO):IEEE TRANS. ELECTRON. PACKAG. MANUF

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Identifier (ISSN):1521-334X(Print)

Clarivate JCR Index Advisory: Not Indexed in Latest JCR

Official Website Submission Portal Compare

Clarivate Impact Factor (IF 2024)

N/A

Journal Impact Factor

IF Trend↓

WoS Quartile

WoS SCIEJCR Quartile

Clarivate WoS JCR

WoS Categories↓

Impact Factor Trend (2018–2023)

Clarivate IF trend for IEEE Transactions on Electronics Packaging Manufacturing

WoS Q1

Annual Impact Factor Metric

Current (2023):0

Scopus SJR & Rank

N/A

SCImago Journal Rank citation prestige weighting

Scopus / Elsevier Data

H-Index (Hirsch Index)

N/A

papers with at least that number of citations each

WoS: SCIE / JCRQ1

Self-Citation RateN/A

Safe Level (< 15%)Warning Level (> 20%)

Self-citation below 15% indicates strong scholarly independence.

Volume & Open AccessSubscription

1articles/year

0% Gold OA•0% Original Research

Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing (acronym: tepm-ieee, abbr: IEEE TRANS. ELECTRON. PACKAG. MANUF, ISSN: 1521-334X) is a peer-reviewed international scholarly journal in the field of Engineering & Technology, in United States. The periodical holds tracked under Web of Science (SCIE) in quartile Q1.

Topics Covered (Recognized by AI)

Engineering86.8%Computer science82.6%Materials science82.4%Physics66.3%Composite material63.5%Electrical engineering61.8%Chemistry55.2%Operating system43.9%Organic chemistry38.6%Physical chemistry38%Optoelectronics37.1%Quantum mechanics37%Metallurgy36.9%Electronic engineering36.5%Nanotechnology34.1%Telecommunications33.4%Thermodynamics27.5%Mechanical engineering27.5%Chip24.7%Layer (electronics)23.5%Mathematics23.5%Electronic packaging22.2%Manufacturing engineering21.5%Soldering20.3%Biology20.1%

Primary Research Areas

Engineering & Technology Engineering: Manufacturing

Official Website NLM PubMed Catalog Submission Portal

0 calls

Special Issues

Calls for Papers

No active Calls for Papers found for this journal.

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WoS Categories & Quartiles

Detailed JCR / JCI category rankings and quartile breakdown from Clarivate

Clarivate JCR

No WoS category details available for this journal.

Annual Historical Statistics & Publications

Track annual publication volume, total citations, and Impact Factor evolution

14 year

2023Latest

IF0

Articles / Year1

Total Citations33

2019

IF0

Articles / Year—

Total Citations—

2018

IF0

Articles / Year—

Total Citations—

2010

IF—

Articles / Year69

Total Citations643

2009

IF—

Articles / Year66

Total Citations853

Year	Impact Factor	Articles / Year	Total Citations
2023	0	1	33
2019	0	—	—
2018	0	—	—
2010	—	69	643
2009	—	66	853
2008	—	71	835
2007	—	69	1,168
2006	—	71	1,010
2005	—	78	1,322
2004	—	57	1,676
2003	—	60	1,206
2002	—	50	1,612
2001	—	50	1,336
2000	—	60	1,137

SCImago & Scopus Journal Intelligence

Not indexed in SCImago / Scopus database

This journal is currently not indexed in Scopus or is an academic publication indexed exclusively in Web of Science (WoS).

Academic Metric Intelligence

Journal Metrics & Citation Visualizations

Total Cites vs Self-Cites

Evaluation of scholarly independence and citation reach

Total citations steady growth

Self-citation: N/A

Citations per Document

Citation metric windows across 2, 3, and 4 years

Cites / Doc (4 years)Cites / Doc (3 years)Cites / Doc (2 years)

Chinese Academy of Sciences (CAS) Classification

Major / minor zone classification and CAS Early Warning List history

Major Category (Broad Field):

Updating

Minor Category (Specific Field):

Updating

CAS Early Warning List History:

Updated annually: 2020 – 2024

2020

Not warned

2021

Not warned

2022

Not warned

2023

Not warned

2024

Not warned

Academic Intelligence Overview & Context

ImpaQ Analysis

The journal enforces rigorous peer evaluation with a publication frequency of Quarterly, an annual output of approximately 1 scientific articles. In terms of accessibility and author fees, it operates under the Subscription model with APC fees are not specified. It serves as a benchmark publication platform for academics, researchers, and doctoral candidates seeking global research visibility.