Interfacial Phenomena and Heat Transfer
Impact Factor Trend (2023–2026)
Clarivate IF trend for Interfacial Phenomena and Heat Transfer
SCImago Journal Rank citation prestige weighting
13 papers with at least that number of citations each
Aims & Scope
Interfacial Phenomena and Heat Transfer aims to serve as a forum to advance understanding of fundamental and applied areas on interfacial phenomena, fluid flow, and heat transfer through interdisciplinary research. The special feature of the Journal is to highlight multi-scale phenomena involved in physical and/or chemical behaviors in the context of both classical and new unsolved problems of thermal physics, fluid mechanics, and interfacial phenomena. This goal is fulfilled by publishing novel research on experimental, theoretical and computational methods, assigning priority to comprehensive works covering at least two of the above three approaches. The scope of the Journal covers interdisciplinary areas of physics of fluids, heat and mass transfer, physical chemistry and engineering in macro-, meso-, micro-, and nano-scale. As such review papers, full-length articles and short communications are sought on the following areas: intense heat and mass transfer systems; flows in channels and complex fluid systems; physics of contact line, wetting and thermocapillary flows; instabilities and flow patterns; two-phase systems behavior including films, drops, rivulets, spray, jets, and bubbles; phase change phenomena such as boiling, evaporation, condensation and solidification; multi-scaled textured, soft or heterogeneous surfaces; and gravity dependent phenomena, e.g. processes in micro- and hyper-gravity. The Journal may also consider significant contributions related to the development of innovative experimental techniques, and instrumentation demonstrating advancement of science in the focus areas of this journal.
Special Issues
Calls for PapersNo active Calls for Papers found for this journal.
WoS Categories & Quartiles
Detailed JCR / JCI category rankings and quartile breakdown from Clarivate
THERMODYNAMICS
THERMODYNAMICS
Annual Historical Statistics & Publications
Track annual publication volume, total citations, and Impact Factor evolution
SCImago & Scopus Journal Intelligence
Global SCImago ranking, SJR prestige index, Scopus coverage, and societal policy impact
Weighted prestige citation metric per document indexed in the Scopus database.
Average citations received per document published in the 2-year window.
Estimated Article Processing Charge for Open Access publication.
Scopus 3-Year Publication & Citation Window
Aggregated from Scopus database across the 3-year SJR evaluation window.
Societal Impact & Inclusivity (SCImago)
Citations in government and international policy documents
Percentage of female authors published in the journal
Real-world societal policy reach and author gender diversity tracked by SCImago.
Scopus Subject Categories
Journal Metrics & Citation Visualizations
Total Cites vs Self-Cites
Evaluation of scholarly independence and citation reach
Citations per Document
Citation metric windows across 2, 3, and 4 years
Chinese Academy of Sciences (CAS) Classification
Major / minor zone classification and CAS Early Warning List history
Academic Intelligence Overview & Context
ImpaQ AnalysisInterfacial Phenomena and Heat Transfer (ISSN: 2169-2785) is a peer-reviewed international scholarly journal in the field of THERMODYNAMICS, published by Begell House in United States. The periodical holds a Journal Impact Factor (JIF) of 0.90, ranking in quartile Q4 of Web of Science (ESCI), a Scopus SJR indicator of 0.264 (Q3), an H-index of 13.
The journal enforces rigorous peer evaluation with an annual output of approximately 16 scientific articles. In terms of accessibility and author fees, it operates under the Subscription model with an estimated APC of $2,635 USD. It serves as a benchmark publication platform for academics, researchers, and doctoral candidates seeking global research visibility.
Publishing & Editorial Information
Detailed publisher, peer-review turnaround, and publication cycle specifications
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